Патрабуецца браўзер Opera.
Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.
To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers, to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance. Domestic substitution demand for protection, optical protection, etc.
Здымак экрану
Пра пашырэньне
- Загрузкі
- 636
- Катэгорыя
- Даступнасьць
- Вэрсія
- 1.0.0
- Памер
- 11.2 КБ
- Last update
- Вер. 19, 2022
- Ліцэнзія
- Copyright 2022 productivework
- Правілы прыватнасьці
- Вэб-сайт сэрвісу
- https://www.epoxyadhesiveglue.com/category/electronic-adhesives-glue/
- Старонка падтрымкі
- https://www.epoxyadhesiveglue.com/
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